Rapid Prototype packaging

Fast-turn solutions can be delivered in days, according to the complexity and quantity

Common challenges

Many semiconductor companies are facing the challenges to identify partners/suppliers which have the capability to support flexible packaging requirements at a reasonable cost and delivery time.

  • Many fabless semiconductor and electronic/optical/sensor/other component developers require a prototype solution that supports the validation of individual die IP, both functionally and performance-wise . In some instances, products may form part of a Multi- Project -Wafer (MPW) and be available as singulated dies, not as complete wafers , which may not be suitable or compatible with final mainstream packaging flows. An alternative approach is required for prototyping delivery to support early validation.

  • Most packaging suppliers focus on small to medium-volume or high-volume production, but are not setup for disruptive prototype builds (Typically 1-10 units).Breaking down or halting existing production is not viable and will not be accepted by volume packaging service suppliers.

  • Failure to identify and procure fast-turn packaging will delay the next design tape-out, early validation , and subsequent New Product Introduction (NPI) activity.

The Solution

At Aquarius we specialise in delivering rapid prototyping services.

We offer flexible prototyping of products in "quick time" and will adapt to our customers' requests at short notice. Rapid prototyping is our focus, and we collaborate with other partners to identify production-scale-up opportunities. We regularly participate in optimisation activities, trials, and associated engineering rework.

See below for our full capabilities

Our capability

Build and test of complete optical receivers for various applications (TIA/PD and TIA/APD), TO-can styles - TO-46/TO-33/TO-52 assemblies

Ceramic package builds, various

TO-can/Custom packaging

Chip on board carrier designs to support fan-out activity

Wire bond packaging – Wedge and Ball bonding

Chip On Board (COB) wirebond and glob top encapsulation

Prototype build capability - from single sample builds to several hundred units per month

Die attach, wire bond - Silver epoxy & pressureless Sinter epoxy

Custom rework -example RF Power amplifier tuning

Wedge & Ball bonding of fine wire and large wire (100-400um ) for power SIC/GaN applications

Resistance weld capability to provide hermetically sealed N2-filled assemblies

Packaging partner introduction for volume production – partner introduction for mainstream production scale-up

Open top QFN –with/without lids

Packaging Consultation